Semiconductor structure and manufacturing method thereof

ABSTRACT

A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of first gate structures, a plurality of second gate structures, a first strained region, and a second strained region. The substrate has a first region and a second region. The first gate structures are disposed in the first region on the substrate. The second gate structures are disposed in the second region on the substrate. The first strained region is formed in the substrate and has a first distance from an adjacent first gate structure. The second strained region is formed in the substrate and has a second distance from an adjacent second gate structure, wherein the second distance is greater than the first distance.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of China application serialno. 201710761591.8, filed on Aug. 30, 2017. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND OF THE INVENTION

Field of the Invention

The invention relates to a semiconductor structure manufacturingtechnique, and more particularly, to a transistor structure in a corecircuit and an input/output (IO) circuit.

Description of Related Art

An electronic circuit generally contains a core circuit and an IOcircuit. The core circuit and the IO circuit respectively contain adesired metal oxide semiconductor (MOS) transistor. The transistor ofthe core circuit corresponds to the operating speed of the core circuit,and a faster operating speed is demanded in design. The transistor of anIO circuit is connected to an external circuit and needs to match theexternal circuit, and therefore in terms of design, the predeterminedoperating speed of the transistor thereof is slower than the operatingspeed of the core circuit.

The transistors of the core circuit and the IO circuit contain the sameor similar processes or structures in manufacture, and therefore the twotransistors are manufactured at the same time. In these similarstructures, the gate structures and the strained regions used as thesource/drain (S/D) regions in the substrate are, for instance,manufactured in the same step at the same time for transistors with thesame conductivity type.

In actuality, based on the size and the target response speed of thetransistors respectively for the core circuit and the IO circuit,different design goals are made in consideration for performancematching. In manufacture, the core circuit and the IO circuit are notseparately manufactured, and therefore in the same manufacture, thedesired target values respectively for the core circuit and the IOcircuit are relatively hard to achieve.

In particular, the distance between the source/drain regions and thegates affects the response speed of the transistor. If it is based onthe manufacturing conditions of the transistor of the core circuit, thenthe performance of the transistor of the IO circuit deviates from thedesign target value, such as the response speed of the transistor is toofast, such that the operation of the overall integrated circuit isflawed in matching.

How to maintain transistor requirements of an IO circuit whilemanufacturing the transistors of the core circuit and the IO circuit atthe same time is a concern of design and manufacture.

SUMMARY OF THE INVENTION

The invention relates to a semiconductor structure and a manufacturingmethod thereof that can adjust the distance from the S/D regions to thegates for different requirements of the transistors of the core circuitand the IO circuit such that the manufacture of the transistors of thecore circuit and the IO circuit can meet design requirements.

According to an embodiment of the invention, a semiconductor structureincludes a substrate, a plurality of first gate structures, a pluralityof second gate structures, a first strained region, and a secondstrained region. The substrate has a first region and a second region.The first gate structures are disposed in the first region on thesubstrate. The second gate structures are disposed in the second regionon the substrate. The first strained region is formed in the substrateand has a first distance from an adjacent first gate structure. Thesecond strained region is formed in the substrate and has a seconddistance from an adjacent second gate structure, wherein the seconddistance is greater than the first distance.

In a semiconductor structure according to an embodiment of theinvention, the first strained region and the second strained region bothcontain a recess in the substrate, and an epitaxial layer is in therecess.

In a semiconductor structure according to an embodiment of theinvention, the material of the epitaxial layer is SiGe.

In a semiconductor structure according to an embodiment of theinvention, the second distance is at least 1.5 times the first distance.

In a semiconductor structure according to an embodiment of theinvention, the thickness of the spacers of a first sidewall of theplurality of first gate structures is the same as the thickness of thespacers of a second sidewall of the plurality of second gate structures.

In a semiconductor structure according to an embodiment of theinvention, the first strained region and the second strained region areused to form source/drain regions with respect to the plurality of firstgate structures and the plurality of second gate structures.

In a semiconductor structure according to an embodiment of theinvention, the first region is a core device region and the secondregion is an I/O device region.

According to an embodiment of the invention, a semiconductor devicemanufacturing method is provided, wherein a substrate has a first regionand a second region. The semiconductor device manufacturing methodincludes forming a plurality of first gate structures in the firstregion on the substrate and a plurality of second gate structures in thesecond region on the substrate. A mask layer is formed on the pluralityof first gate structures and the plurality of second gate structures,wherein the mask layer is entirely higher than the plurality of firstgate structures and the plurality of second gate structures. The masklayer is planarized to obtain a flat surface; forming an etch mask layeron the flat surface of the mask layer. The etch mask layer has aplurality of first mask regions covering the plurality of first gatestructures and extended by a first distance and a plurality of secondmask regions covering the plurality of second gate structures andextended by a second distance. The second distance is substantiallygreater than the first distance. An etching process is performedaccording to the etch mask layer to expose a plurality of surfaceregions of the substrate. A plurality of strained regions is formed inthe plurality of surface regions in the substrate. The mask layer is theremoved.

In a semiconductor device manufacturing method according to anembodiment of the invention, the step of forming the plurality ofstrained regions includes etching the substrate in the plurality ofsurface regions to form a plurality of recesses in the substrate,removing the etch mask layer, and forming an epitaxial layer in theplurality of recesses.

In a semiconductor device manufacturing method according to anembodiment of the invention, the material of the epitaxial layer isSiGe.

In a semiconductor device manufacturing method according to anembodiment of the invention, the second distance is at least 1.5 timesthe first distance.

In a semiconductor device manufacturing method according to anembodiment of the invention, the first strained region and the secondstrained region are used to form source/drain regions with respect tothe plurality of first gate structures and the plurality of second gatestructures.

In a semiconductor device manufacturing method according to anembodiment of the invention, the first region is a core device regionand the second region is an I/O device region.

In a semiconductor device manufacturing method according to anembodiment of the invention, the thickness of the mask layer is enoughto completely fill the space between an adjacent pair in the pluralityof first gate structures and the plurality of second gate structures.

According to an embodiment of the invention, a semiconductor devicemanufacturing method is provided, wherein a substrate has a first regionand a second region. The semiconductor device manufacturing methodincludes forming a plurality of first gate structures in the firstregion on the substrate and a plurality of second gate structures in thesecond region on the substrate. A mask layer is formed on the pluralityof first gate structures and the plurality of second gate structures,wherein the mask layer is kept conformal to the plurality of first gatestructures and the plurality of second gate structures. An etch masklayer is formed on the mask layer to cover the plurality of second gatestructures and extended by a distance, wherein the etch mask layer doesnot cover the plurality of first gate structures. An etching process isperformed, using the etch mask layer to expose a plurality of surfaceregions of the substrate. A plurality of strained regions is formed inthe plurality of surface regions in the substrate. The mask layer isremoved.

In a semiconductor device manufacturing method according to anembodiment of the invention, the step of forming the plurality ofstrained regions includes etching the substrate in the plurality ofsurface regions to form a plurality of recesses in the substrate,removing the etch mask layer, and forming an epitaxial layer in theplurality of recesses.

In a semiconductor device manufacturing method according to anembodiment of the invention, the material of the epitaxial layer isSiGe.

In a semiconductor device manufacturing method according to anembodiment of the invention, a second distance from the strained regionsto an adjacent second gate structure is at least 1.5 times a firstdistance from the strained regions to an adjacent first gate structure.

In a semiconductor device manufacturing method according to anembodiment of the invention, the plurality of strained regions is usedto form source/drain regions with respect to the plurality of first gatestructures and the plurality of second gate structures.

In a semiconductor device manufacturing method according to anembodiment of the invention, the first region is a core device regionand the second region is an I/O device region.

In a semiconductor device manufacturing method according to anembodiment of the invention, the thickness of the mask layer is within arange and conformal to the plurality of first gate structures and theplurality of second gate structures.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1 is a schematic of a semiconductor structure according to theinvention.

FIG. 2 is a schematic of a semiconductor structure according to anembodiment of the invention.

FIGS. 3A to 3E are schematics of the manufacturing process of asemiconductor structure according to an embodiment of the invention.

FIGS. 4A to 4D are schematics of the manufacturing process of asemiconductor structure according to an embodiment of the invention.

DESCRIPTION OF THE EMBODIMENTS

Hereinafter, exemplary embodiments of the invention are described indetail, and examples of the exemplary embodiment are conveyed via thefigures. Wherever possible, the same reference numerals are used in thedrawings and the descriptions to refer to the same or similar portions.

A complete integrated circuit generally contains a core circuit and anIO circuit distributed on the same wafer and manufactured at the sametime. The transistor of the core circuit corresponds to the operatingspeed of the core circuit, and a faster operating speed is demanded indesign. The transistor of an IO circuit is connected to an externalcircuit and needs to match the external circuit, and therefore in termsof design, the predetermined operating speed of the transistor thereofis slower than the operating speed of the core circuit.

One of the factors for adjusting the operating speed of the transistoris the distance between the source/drain regions and the gates. In otherwords, for the transistor of the core circuit, the distance from thesource/drain regions thereof to the gates can be designed to be lessthan the distance from the source/drain regions of the transistor of theIO circuit to the gates. Therefore, the transistor of the IO circuit canmeet design requirements.

However, in semiconductor manufacture, the transistors of the corecircuit and the IO circuit are manufactured by the same method, and thedistance from the source/drain regions to the gates is the same. As aresult, the operating speed of the transistor of the IO circuit issignificantly higher than the design, such that abnormal operationoccurs.

The traditional method has not provided an effective method to adjustthe distance from the source/drain regions to the gates.

FIG. 1 is a schematic of a semiconductor structure according to theinvention. Referring to FIG. 1, in the invention, potential issues arelooked into. Hereinafter, the transistors of the semiconductor structurein the core circuit and the IO circuit are described.

A first region 10 and a second region 20 are planned on the substrate100 and are separated by, for instance, isolation structures 102. Thefirst region 10 and the second region 20 are, for instance, manufacturedin response to the core circuit and the IO circuit. A plurality of gatestructures 104 is in the first region 10. A plurality of gate structures112 is in the second region 20. Here, the number of the gate structuresshown in FIG. 1 is only exemplary.

A gate insulating layer 103 is between the gate structures 104 and 112and the substrate, such as a gate oxide layer. Spacers 105 and 113 areprovided to the sidewalls of the gate structures 104 and 112. The gatestructures 104 and 112 can be known gate structures and can also be astacked structure which is elaborated in the embodiments below.

The transistor of the IO circuit corresponds to, for instance, thedemand of circuit matching, wherein the size thereof is greater andresponse speed is slower, and therefore a distance 116 between a pair ofgate structures 112 is greater. Strained regions 106 are formed in thesubstrate 100 between the gate structures 112 and are, for instance,SiGe epitaxial layers as the source/drain regions. Similarly, thetransistor of the core circuit of the first region 10 is smaller, andtherefore the width of the gate structures 104 is smaller and a distance108 between the gate structures 104 is smaller.

However, since the spacers 113 of the gate structures are formed in thesame process, a first distance 110 between the strained regions 106 ofthe core circuit of the first region 10 and the gate structures 104 issubstantially the same as a second distance 118 between the strainedregions 106 of the IO circuit of the second region 20 and the gatestructures 112.

Similar to the structure of FIG. 1, the first distance 110 and thesecond distance 118 are substantially the same, such that the responsespeed of the transistor of the IO circuit of the second region 20 ismuch faster than the predetermined target, and therefore deviation fromthe design target occurs.

FIG. 2 is a schematic of a semiconductor structure according to anembodiment of the invention. Referring to FIG. 2, a structure of the IOcircuit of the second region 20 more in line with the design objectivecan be shrunk in the strained regions 106 of the second region 20 and isextended greater at the bottom of the spacers 113 of the gate structures112. As a result, the second distance 122 between the strained regions106 of the IO circuit of the second region 20 and the gate structures112 is greater than the first distance 110 between the strained regions106 of the core circuit of the first region 10 and the gate structures104.

In an embodiment, the second distance 122 is at least 1.5 times thefirst distance 110.

Relatively speaking, the distance 116 is, for instance, 1180 Å, and thedistance 108 is, for instance, 720 Å. An effective first distance 110 is80 Å, and an effective second distance 122 is 150 Å. However, theinvention is not limited to the sizes listed.

Some embodiments are provided below to describe how to easilymanufacture the semiconductor structure of FIG. 2, wherein the seconddistance 122 of the transistor of the IO circuit of the second region 20can better meet design goals. Moreover, it is known that theconductivity type of the transistors can be P type or N type. Thetransistors of the embodiments provided in the invention are not limitedto P type or N type, but P type transistors of two regions aremanufactured together, and N type transistors are also manufacturedtogether.

FIGS. 3A to 3E are schematics of the manufacturing process of asemiconductor structure according to an embodiment of the invention.Please refer to FIG. 3. Referring to FIG. 3A, as described above, afirst region 10 and a second region 20 are planned on the substrate 100and are separated by isolation structures 102. The number of the gatestructure is not limited, and is generally a large number. A gateinsulating layer 103 is on the substrate 100 and is obtained by, forinstance, the oxidation of the substrate 100. Therefore, since theportions of the gate insulating layer 103 on the isolation structures102 are combined, a reference numeral is not provided.

On the gate insulating layer 103, a gate layer 156 is respectivelyformed in the first region 10 and the second region 20. The width of thegate layer 156 of the first region 10 is smaller than the width of thegate layer 156 of the second region 20. Based on actual need, the gatelayer 156 is stacked with the insulating layers of some dielectricmaterials, including a dielectric layer 158 and a hard dielectric layer160 that are integrated into the gate structures 104 and 112 of FIGS. 1and 2.

Moreover, based on overall design needs, a sealing layer 150 and a hardmask layer 152 conformal to the gate structures are further formed, andthe material thereof is, for instance, SiOCN and the thicknesses thereofare, for instance, 27 Å and 70 Å, but the invention is not limitedthereto.

In the invention, the effect as shown in FIG. 2 is increased bycontrolling the thickness of the spacers of the gate structures toobtain the second distance 122 in the second region 20. In the presentembodiment, a hard mask layer 154 is further formed to maintain theconformal thickness with the gate structures to cover the gatestructures of the first region 20 and the second region 20. Thethickness of the mask layer 154 is relatively greater but does not needto completely fill the space between the gate structures, and can be,for instance, less than 250 Å but greater than the sealing layer 150 andthe hard mask layer 152. The material of the mask layer 154 is, forinstance, SiN which is different from SiOCN, but is not limited thereto.

Referring to FIG. 3B, an etch mask layer 162 is formed on the gatestructures covering the plurality of second gate layers 156 and extendedby a distance, and the distance is used for increasing the spacerthickness in a subsequent process. In the present embodiment, the etchmask layer 162 does not cover the mask layer 154 of the first region 10.

Referring to FIG. 3C, etching is performed using the etch mask layer 162as a mask, such as anisotropic dry etching. Since the material of themask layer 154 is, for instance, SiN which is different from SiOCN ofthe mask layer 152, an etchant having a suitable etch selectivity isselected such that the mask layer 154 can be etched into a smallerthickness substantially until SiOCN. However, the invention is notlimited to the above methods.

Referring to FIG. 3D, the mask layer 162 is etched and a suitableetchant is used, lastly a greater thickness of the spacer of the gatestructures of the second region 20 is decided by the width of the etchmask layer 162, and the thickness of the spacers of the gate structuresof the first region 10 is relatively smaller. When the etching step iscontinued, the surface between the gate layers 156 on the substrate 100is exposed. At this point, changing the etchant can form recesses 166 aand 166 b on the substrate 100. Moreover, if needed, an implantationstep 170 can also be performed on the recessed substrate 100. Theimplantation step 170 is performed based on actual need, and is not anecessary step. Before the subsequent strained regions are formed, theetch mask layer 162 is, for instance, a photoresist layer and isremoved.

Referring to FIG. 3E, epitaxial layers 168 a and 168 b are formed in therecesses 166 a and 166 b as strained regions. The epitaxial layers 168 aand 168 b are, for instance, SiGe. The epitaxial layers 168 a and 168 bare used as the source/drain regions. Lastly, the mask layer 154 is alsoremoved. In the present embodiment, the sealing layer 150 and the hardmask layer 152 are kept as spacers of the gate structures, but theinvention is not limited thereto. In other words, the sealing layer 150and the hard mask layer 152 can also be partially or completely removed.

In the manufacturing process above, by controlling the width of the etchmask layer 162, the spacers of the gate structures in the first region10 can keep a small thickness such that the distance between theepitaxial layer 168 a and the gate layers 156 is kept small to meet thedemands for the core circuit. Moreover, the spacers of the gatestructures in the second region 20 can keep a large thickness such thatthe distance between the epitaxial layer 168 b and the gate layers 156is kept large to meet the demands for the IO circuit.

Under the same technical concept, the invention further provides anothermanufacturing process. FIGS. 4A to 4D are schematics of themanufacturing process of a semiconductor structure according to anembodiment of the invention.

Referring to FIG. 4A, a first region 10 and a second region 20 areplanned on the substrate 200 and are separated by isolation structures202. The number of the gate structures is not limited, and is generallya large number. A gate insulating layer 203 is on the substrate 200 andis obtained by, for instance, the oxidation of the substrate 200.Therefore, since the portions of the gate insulating layer 203 on theisolation structures 202 are combined, a reference numeral is notprovided.

On the gate insulating layer 203, a gate layer 256 is respectivelyformed in the first region 10 and the second region 20. The width of thegate layer 256 of the first region 10 is smaller than the width of thegate layer 256 of the second region 20. Based on actual need, the gatelayer 256 is stacked with the insulating layers of some dielectricmaterials, including a dielectric layer 258 and a hard dielectric layer260 that are integrated into the gate structures 104 and 112 of FIGS. 1and 2.

Moreover, based on overall design needs, a sealing layer 250 and a hardmask layer 252 conformal to the gate structures are further formed, andthe material thereof is, for instance, SiOCN and the thicknesses thereofare, for instance, 27 Å and 70 Å, but the invention is not limitedthereto.

In an embodiment of the invention, the effect as shown in FIG. 2 isincreased by controlling the thickness of the spacers of the gatestructures to obtain the second distance 122 in the second region 20. Inthe present embodiment, a hard mask layer 254 is further formed to coverthe gate structures of the first region 10 and the second region 20. Thedifference of the present embodiment and FIG. 3A includes a greaterthickness of the mask layer 254, such as greater than 500 Å which isenough to completely fill the space between the gate structures. Thematerial of the mask layer 254 is, for instance, SiN which is differentfrom SiOCN, but is not limited thereto.

Next, referring to FIG. 4B, planarization is performed on the mask layer254 first, such as performing polishing to obtain a flat surface. Theflat surface facilitates the forming of the etch mask layer 262. Theetch mask layer 262 is, for instance, a photoresist layer, and patternshaving different sizes are respectively obtained in the first region 10and the second region 20 via a lithography process. The devices in thefirst region 10 belong to a core circuit, the width of the gate layer256 thereof is smaller, and the first distance 110 in FIG. 2 is alsodesigned to be shorter. The devices in the second region 20 belong to anIO circuit, the width of the gate layer 256 thereof is greater, and thesecond distance 110 in FIG. 2 is also designed to be longer.

In the present embodiment, the difference between the first distance 110and the second distance 122 is controlled by etching using the masklayer 262. The etch mask layer 262 of the first region 10 is patternedinto a plurality of mask regions respectively covering the gatestructures containing the gate layer 256 and extended by a distance. Anopening 230′ between two adjacent mask regions is planned in asubsequent substrate 200, such as the location in which a strained layer268 a is to be formed as shown in FIG. 4D.

Similarly, the etch mask layer 262 of the second region 20 is patternedinto a plurality of mask regions covering the gate structures containingthe gate layer 256 and extended by a greater distance. An opening 230between two adjacent mask regions is subsequently planned in thesubstrate 200, such as the location in which a strained layer 268 b isto be formed as shown in FIG. 4D.

Referring to FIG. 4C, an etching process is continued for two patternsusing the etch mask layer 262, wherein since a plurality of materialsneeds to be etched, the etchant can be changed as needed. The etchingprocess is continued until a recess 268 b corresponding to the opening230 of the second region is formed and a recess 268 a corresponding tothe opening 230′ of the first region 10 is formed in the substrate 200.Moreover, if needed, an implantation step 270 can also be performed onthe recessed substrate 100. The implantation step 270 is performed basedon actual need, and is not a necessary step. Before the subsequentstrained regions are formed, the etch mask layer 262 is, for instance, aphotoresist layer and is removed.

Due to the adjustment of the etch mask layer 262 on the opening 230′ inthe first region 10 and the opening 230 in the second region 20, thedistances for the recess 268 a and the recess 268 b to the adjacent gatelayer 256 can be accurately configured.

Referring to FIG. 4D, epitaxial layers 268 a and 268 b are formed in therecesses 266 a and 266 b as strained regions. The epitaxial layers 268 aand 268 b are, for instance, SiGe. The epitaxial layers 268 a and 268 bare used as the source/drain regions. Lastly, the mask layer 254 is alsoremoved. In the present embodiment, the sealing layer 250 and the hardmask layer 252 are kept as spacers of the gate structures, but theinvention is not limited thereto. In other words, the sealing layer 250and the hard mask layer 252 can also be partially or completely removed.

The invention provides a technique shown in FIG. 2 and the seconddistance 122 is controlled to be greater than the first distance 110 toachieve the respective demands for the core circuit and the IO circuit.The manufacturing method thereof can be implemented by, for instance,the methods of the embodiments.

Lastly, it should be mentioned that: each of the above embodiments isonly used to describe the technical solutions of the invention and isnot intended to limit the invention; and although the invention isdescribed in detail via each of the above embodiments, those havingordinary skill in the art should understand that: modifications canstill be made to the technical solutions recited in each of the aboveembodiments, or portions or all of the technical features thereof can bereplaced to achieve the same or similar results; the modifications orreplacements do not make the nature of corresponding technical solutionsdepart from the scope of the technical solutions of each of theembodiments of the invention.

What is claimed is:
 1. A semiconductor device manufacturing method,wherein a substrate has a first region and a second region, comprising:forming a plurality of first gate structures in the first region on thesubstrate and a plurality of second gate structures in the second regionon the substrate; forming a mask layer on the plurality of first gatestructures and the plurality of second gate structures, wherein the masklayer has an uppermost surface higher than uppermost surfaces of theplurality of first gate structures and the plurality of second gatestructures; planarizing the mask layer to obtain a flat surface; formingan etch mask layer on the flat surface of the mask layer, wherein theetch mask layer has a plurality of first mask regions covering theplurality of first gate structures and extended by a first distance anda plurality of second mask regions covering the plurality of second gatestructures and extended by a second distance, wherein the seconddistance is substantially greater than the first distance; performing anetching process according to the etch mask layer to expose a pluralityof surface regions of the substrate; forming a plurality of strainedregions in the plurality of surface regions in the substrate; andremoving the mask layer.
 2. The semiconductor device manufacturingmethod of claim 1, wherein the step of forming the plurality of strainedregions comprises: etching the substrate in the plurality of surfaceregions to form a plurality of recesses in the substrate; removing theetch mask layer; and forming an epitaxial layer in the plurality ofrecesses.
 3. The semiconductor device manufacturing method of claim 2,wherein a material of the epitaxial layer is SiGe.
 4. The semiconductordevice manufacturing method of claim 1, wherein the second distance isat least 1.5 times the first distance.
 5. The semiconductor devicemanufacturing method of claim 1, wherein the first strained region andthe second strained region are used to form source/drain regions withrespect to the plurality of first gate structures and the plurality ofsecond gate structures.
 6. The semiconductor device manufacturing methodof claim 1, wherein the first region is a core device region and thesecond region is an I/O device region.
 7. The semiconductor devicemanufacturing method of claim 1, wherein a thickness of the mask layeris sufficient to completely fill a space between an adjacent pair in theplurality of first gate structures and the plurality of second gatestructures.
 8. A semiconductor device manufacturing method, wherein asubstrate has a first region and a second region, comprising: forming aplurality of first gate structures in the first region on the substrateand a plurality of second gate structures in the second region on thesubstrate; forming a mask layer on the plurality of first gatestructures and the plurality of second gate structures, wherein the masklayer is kept conformal to the plurality of first gate structures andthe plurality of second gate structures; forming an etch mask layer onthe mask layer to cover the plurality of second gate structures andextended by a distance, wherein the etch mask layer does not cover theplurality of first gate structures; performing an etching process usingthe etch mask layer to expose a plurality of surface regions of thesubstrate; forming a plurality of strained regions in the plurality ofsurface regions in the substrate; and removing the mask layer, whereinthe plurality of strained regions are used to form source/drain regionswith respect to the plurality of first gate structures and the pluralityof second gate structures.
 9. The semiconductor device manufacturingmethod of claim 8, wherein the step of forming the plurality of strainedregions comprises: etching the substrate in the plurality of surfaceregions to form a plurality of recesses in the substrate; removing theetch mask layer; and forming an epitaxial layer in the plurality ofrecesses.
 10. The semiconductor device manufacturing method of claim 9,wherein a material of the epitaxial layer is SiGe.
 11. The semiconductordevice manufacturing method of claim 8, wherein a second distance fromthe strained regions to a directly adjacent second gate structure is atleast 1.5 times a first distance from the strained regions to a directlyadjacent first gate structure, wherein the second distance and the firstdistance are measured along a direction parallel with a top surface ofthe substrate.
 12. The semiconductor device manufacturing method ofclaim 8, wherein the first region is a core device region and the secondregion is an I/O device region.
 13. The semiconductor devicemanufacturing method of claim 8, wherein a thickness of the mask layeris within a range and conformal to the plurality of first gatestructures and the plurality of second gate structures.